The second Chicago megasite reaches structural completion eleven months after groundbreaking, and will house Swargate's first co-located advanced packaging line.
CHICAGO — Swargate Semiconductor celebrated the structural completion of GigaFab Chicago II today, eleven months after groundbreaking. The 130,000 m² facility will add 90,000 wafer starts per month of SG2 capacity when it enters production in 2027.
Chicago II will also house Swargate's first co-located SwarStack 3D packaging line, allowing logic wafers to move from front-end processing to hybrid bonding without leaving the campus — cutting weeks from advanced-packaging cycle times.
The site is designed to be Swargate's first net-water-positive fab, combining a closed-loop ultrapure water plant with a managed aquifer recharge program developed with local authorities.
About Swargate Semiconductor
Swargate Semiconductor Inc. (NASDAQ: SWGT) is a pure-play foundry headquartered in Chicago, Illinois, manufacturing advanced logic from automotive-grade 7nm to 2nm gate-all-around silicon across five fabs on three continents. Founded in 2021, Swargate serves customers in AI, mobile, automotive, and edge computing with 1.4 million wafer starts per year.
Media contact: press@swargate.example · +1 312 555 0140
